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Regenerative Biomaterials

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会刊简介

中国生物材料学会会刊——Regenerative Biomaterials (RB)是中国生物材料学会与牛津大学出版社合作出版的国际英文学术期刊。中国生物材料学会理事长、中国工程院院士、四川大学张兴栋教授与美国德州大学奥斯汀分校、美国国家工程院、医学院院士Nicholas Peppas教授出任共同主编。本刊旨在为研究人员提供一个分享有关生物材料前沿研究与新发现的国际平台,尤其是用于再生医学的生物材料。RB是同行评审的在线开放获取刊物,出版原创研究论文、综述、与先进再生生物材料发展相关的话题评论等,内容涵盖生物材料的基础科研和临床应用。本刊的创刊号已于今年11月正式上线出版,目前被PubMed,SCI-E等数据库收录。欢迎广大读者登录会刊官网https://academic.oup.com/rb免费注册、订阅和投稿。


RB的主要范围包括但不局限于以下内容:

? Design, synthesis, and evaluation of biomaterials for tissue engineering and regenerative medicine

? Nanotechnologies and novel processing for preparing biomimetic scaffolds

? Interaction of biomaterial with cells, especially with stem cells

? Regenerative mechanisms of tissue by using biomaterials and/or stem cells

? Drug/gene delivery materials and methods

? Clinical applications of regenerative biomaterials

? Scientific bases of evaluation and quality control of biomedical materials

? Surface modification of biomaterials

? Safety assessment of biomedical materials

? Stem cells fate controlled by materials signals

? Improvement of implanted medical devices

? Biomechanics of biomaterials and devices

? Regenerative engineering


Editorial Board

Editors-in-Chief

Nicholas Peppas, University of Texas at Austin, USA

Xingdong Zhang, Sichuan University, China

Associate Editors

Fu-Zhai Cui, Tsinghua University, China

C. James Kirkpatrick, Johann Wolfgang Goethe University of Frankfurt, Germany

Cato Laurencin, University of Connecticut, USA


Editorial Board Members

Hua Ai, Sichuan University, China

Luigi Ambrosio, National Research Council, Italy

James Anderson, Case Western Reserve University, USA

Mario Barbosa, University of Porto, Portugal

Serena Best, University of Cambridge, UK

Jiang Chang, Shanghai Institute of Ceramics, CAS, China

Maria Chatzinikolaidou, University of Crete, Greece

Guoping Chen, National Institute for Materials Science, Japan

Jiandong Ding, Fudan University, China

Xiaobing Fu, PLA General Hospital, China

Akhilesh Gaharwar, Texas A&M University, USA

Changyou Gao, Zhejiang University, China

Andres Garcia, Georgia Institute of Technology, USA

Xiaosong Gu, Nantong University, China

Pamela Habibović, Maastricht University, Netherlands

Vasıf Hasırcı, Middle East Technical University, Ankara, Turkey

Julianne Holloway, Arizona State University, USA

Nan Huang, Southwest Jiaotong University, China

Maria Jose Alonso, University of Santiago de Compostela, Spain

Ali Khademhosseini, University of California, Los Angeles, USA

Deling Kong, Nankai University, China

In-Seop Lee, Yonsei University, Korea

Changsheng Liu, East China University of Science and Technology, China

Helen Lu, Columbia University, USA

Peter Ma, University of Michigan, USA

Penny Martens, University of New South Wales, Australia

Alvaro Mata, Queen Mary University of London, UK

Keith McLean, CSIRO, Australia

Antonios Mikos, Rice University, USA

Samir Mitragorti, Harvard University, USA

Julien Nicolas, University of Paris-Sud, France

Elżbieta Pamuła, AGH University of Science and Technology, Poland

Milica Radisic, University of Toronto, Canada

Seeram Ramakrishna, Singapore National University, Singapore

Buddy Ratner, University of Washington, USA

Rui Reis, University of Minho, Portugal

Kevin Shakesheff, University of Nottingham, UK

Ólafur Sigurjónsson, Reykjavik University, Iceland

Yasuhiko Tabata, University of Kyoto, Japan

Johnna Temenoff, Georgia Tech and Emory University, USA

Maria Vallet-Regí, Computense University of Madrid, Spain

Yingjun Wang, South China University of Technology, China

Xiumei Wang, Tsinghua University, China

Ke Yang, Institute of Metal Research, CAS, China

Hyeong-Cheol Yang, Seoul National University, Korea

Jackie Ying, Institute of Bioengineering and Nanotechnology, Singapore

Ryo Yoshida, University of Tokyo, Japan

Xianzheng Zhang, Wuhan University, China

Xuedong Zhou, West China Hospital of Stomatology, China


Editorial Office


Managing Editor


Wanlu Zhao, Sichuan University (Chinese Society for Biomaterials), China

Email: info2@csbm.org.cn; lldew@qq.com


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